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The Chemical Show Podcast Podcast: “Creating a greener planet with sustainable innovation”
Flexible Packaging That Uses 35% Less Plastic?
VOID Opens First R&D and Compound Manufacturing Facility for Flexible Packaging with Less Plastic
VOID Opens R&D and Compound Manufacturing Facility for Sustainable Flexible Packaging
4X Tougher: VOID Launches New VO3D® PLA Filament with Nanotechnology