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VOID Opens First R&D and Compound Manufacturing Facility for Flexible Packaging with Less Plastic

VOID 08.03.22
net-gutter

Neenah, Wisconsin (USA) – March 8, 2022 – VOID Technologies, a materials science company, has officially opened its first US-based, plastic reduction research labs and compound manufacturing facility to help packaging
manufacturers and brand owners transition to more sustainable plastics and packaging.

Following a multi-million-dollar investment, the new facility in Neenah, Wisconsin offers R&D services and toll compounding for customers interested in developing flexible polyethylene (PE) packaging based on VOID’s patented
VO+ technology.

VO+ engineers nano- and micro-scale air pockets into plastics to create high-performance products with a lower environmental impact. It is effective in a range of thermoplastics including polyolefins and polyesters. The technology
is most developed in white Machine Direction Orientation (MDO) PE films. By combining the benefits of MDO with VO+ cavitation technology, products can achieve:

  • Material reduction: Lower density and downgauging
  • Enhanced performance: Improved puncture, toughness, and high opacity without TiO2
  • Improved recycling: VO+ white films turn clear during recycling because they are free of pigments like TiO2

With the official opening of the site, VOID has launched VOID Labs, an R&D Services business through which plastics, packaging, and consumer goods companies can access the company’s start-of-the-art equipment. That includes pilot-scale blown film extrusion with inline MDO, lab- and commercial-scale twin screw compounding, as well as a range of testing and analytical equipment.
“VOID is combining VO+ plastic reduction technology with R&D Services to help manufacturers and brand owners accelerate their commercialization programs for MDO PE films and flexible packaging. VO+ MDO PE films allow
companies to reduce their plastic footprint by addressing the tension between material reduction, performance and recyclability,” said VOID CEO James Gibson.

VOID is already working with leading companies along the supply chain to develop VO+ MDO PE films for a range of applications such as laminates, wicketed bags and frozen food. The company expects initial product launches in the second half of 2022.

About VOID Technologies
VOID is a materials science company accelerating the transition to more sustainable plastics and packaging. The company combines its VO+ technology and R&D labs to help plastic and packaging companies rapidly develop new
innovative products with a reduced environmental footprint. VOID’s extensively patented VO+ technology was first conceived as part of a research initiative at Kimberly-Clark. Soon after, in 2015, VOID was launched as an independent company. Today, VOID has R&D labs and a compound manufacturing facility based in Neenah, Wisconsin (USA) and has commercial teams in Canada, France, and the UK. Learn more at:
www.voidtechnologies.com

Contact
Jackie Guscott MacAllen
+1 332-217-5334
jackie.guscottmacallen@voidtechnologies.com